Ultra-thin Single Crystal Diamond

Ultra-thin Single Crystal Diamond (UT-SCD) is fabricated from standard {100} full single crystal substrates using precision double-sided thinning and atomic-level ultra-precision polishing. It features an ultra-thin thickness range of 25 μm to 0.2 mm, with strict control over internal stress, warpage deformation, and lattice damage throughout the manufacturing process.
It retains the core intrinsic properties of single crystal diamond: ultra-high thermal conductivity, high electrical insulation, and low thermal expansion. Meanwhile, it overcomes the drawbacks of conventional thick diamond substrates, such as excessive rigidity, poor compatibility with ultra-thin packaging, and weak heterogeneous bonding.
It is suitable for compact and thin semiconductor and optoelectronic applications including ultra-thin chip mounting, thin-film devices, optical windows, ultra-thin diamond carriers, and miniature heat dissipation chambers. It supports full secondary processing such as gold plating, copper plating, microchannel etching, and direct bonding.