It has three major characteristics: ultra-high thermal conductivity, ultra-high hardness and wear resistance, and high insulation and voltage resistance. It is mainly used in the selection of materials for four large IGBT module substrates: traction electric transmission heat dissipation, braking friction, precision machining, and structural wear-resistant coating. The main considerations are its high-voltage electrical insulation performance, thermal performance (high temperature and high thermal conductivity), and mechanical performance (matching with the thermal expansion coefficient of surrounding materials).

Diamond has superior thermal conductivity, with a thermal conductivity of 1000-2200 W/(m · K), far higher than traditional ceramic substrate materials.