Diamond materials have become a key material for solving heat dissipation bottlenecks in high-power LED packaging due to their ultra-high thermal conductivity, high insulation, low thermal expansion coefficient, and excellent optical transparency. Their main applications are as follows:

1. LED chip transition heat sink and heat dissipation substrate

The thermal conductivity of diamond heat sink can reach 1000-2000 W/(m · K), which can quickly dissipate heat from the chip, significantly reduce thermal resistance and junction temperature, improve LED brightness, luminous efficiency, and long-term reliability.

2. High thermal conductivity insulation layer for LED packaging

Introducing diamond thin film or diamond composite dielectric layer into the structure of copper-clad ceramic substrate (DBC/AMB) can significantly enhance the lateral and longitudinal thermal conductivity while ensuring high voltage insulation, improve the temperature uniformity of the chip array, and reduce local hotspots.

3. LED module heat sharing and dissipation structural components

Composite materials such as diamond copper and diamond aluminum have high thermal conductivity and structural strength, and are used as heat dissipation substrates and thermal diffusion layers for LED modules. They can quickly diffuse point heat sources into surface heat dissipation, further improving overall heat dissipation efficiency.