Heat dissipation: prevents high-power lasers from burning, increases power, and prolongs lifespan; Optics: making windows and lenses, resistant to damage, wide bandwidth, and deformation free; Function: Perform Raman laser and quantum laser to achieve new bands and functions.

However, thermal effects during operation can lead to a decrease in laser output power, a decrease in electro-optical conversion efficiency, and in severe cases, a shortened device lifespan.

The core requirements for the transition heat sink in high-power semiconductor laser packaging are mainly reflected in two aspects: low thermal resistance and low thermal mismatch.

Diamond heat sink has an ultra-high thermal conductivity of up to 2200 W/(K · m), and its application as a transition heat sink in high-power semiconductor lasers can significantly improve the device's heat dissipation performance.