Gold plated diamond

Using high-thermal-conductivity single-crystal / polycrystalline CVD diamond as the insulating heat-dissipation substrate, the surface is metallized via a composite process combining magnetron sputtering as an underlayer and electroplated gold, forming Ti/Pt/Au or Ti/Ni/Au multilayer metal coatings.
It integrates diamond’s ultra-high thermal conductivity and electrical insulation with the gold layer’s superior bonding, soldering, and oxidation resistance. It is specially designed to solve high heat flux density cooling challenges in third-generation semiconductors, high-power lasers, and microwave RF devices.
The product is compatible with three mainstream packaging processes: gold wire bonding, AuSn eutectic soldering, and nano-silver sintering.