Diamond‑Aluminum Composite

Diamond‑Aluminum Composite Heat Sink (Al‑Dia), manufactured via vacuum pressure infiltration process, is a lightweight metal‑matrix high‑thermal‑conductivity composite heat dissipation material. It is integrally formed at high temperature via vacuum infiltration using high‑purity micron‑scale diamond particles combined with 6061 oxygen‑free aluminum alloy, without adhesives, internal voids or interfacial delamination. It represents a new generation of lightweight high‑performance heat dissipation substrate following diamond‑copper composites.
It combines the ultra‑high thermal conductivity and low thermal expansion of diamond with the advantages of aluminum alloy: ultra‑light weight, excellent machinability, lower cost and outstanding electromagnetic shielding performance. This solves key industry pain points, including insufficient thermal conductivity of pure aluminum, excessive weight of diamond‑copper composites, and the heavy weight and poor thermal conductivity of tungsten‑copper / molybdenum‑copper alloys.
It is specially designed for weight‑sensitive thermal management applications: automotive power electronics, aerospace vehicles, portable high‑power equipment and satellite communication components, meeting both high heat dissipation efficiency and system‑level lightweight requirements. It can be directly used as chip‑mountable heat sinks, thermal spreading substrates and packaging heat dissipation submounts.