Diamond Copper Composite Liquid Cooling Plate

Core Structure & Materials
1.Base Body: High thermal conductivity pure copper liquid cooling chamber with precision internal flow channels formed by integral milling / vacuum brazing. Features high pressure resistance and extremely low risk of leakage, compatible with cooling media including deionized water and ethylene glycol coolant.
2.Thermal Interface Layer: Diamond-copper heat sink sheet with thermal conductivity up to 850 W/(m·K), significantly higher than pure copper (401 W/(m·K)) and aluminum. It closely attaches to the chip heat source area to rapidly dissipate concentrated high heat flux.
3.Composite Process: The diamond-copper heat sink sheet and high thermal conductivity pure copper liquid cooling chamber are joined by melt infiltration sintering, ensuring no delamination, low thermal interface resistance, and reliable performance under high-low temperature cycling and long-term high-power operating conditions.
4.Interface Configuration: Standard plastic quick-connect water cooling connectors; threaded metal connectors are customizable. Standard mounting screw holes are reserved around the perimeter, suitable for heat dissipation in server CPUs, GPUs, ASICs, FPGAs, IGBTs, SiC power modules, and high-power lasers.