Diamond copper composite heatsink

Diamond-Copper Composite Heat Sink (Cu-Dia) produced by vacuum infiltration process is a new generation metal-matrix composite with high thermal conductivity. It is integrally fabricated via vacuum infiltration and sintering using high-purity diamond particles combined with oxygen-free copper, featuring no internal voids, no interfacial delamination, and no adhesive impurities.
It integrates the advantages of ultra-high thermal conductivity and low thermal expansion of diamond with excellent weldability, machinability and electrical conductivity of copper. This solves key industry pain points, including insufficient thermal conductivity of pure copper, high cost and poor machinability of pure diamond, and cracking caused by poor thermal expansion matching with chips.
It is specially designed for high heat flux dissipation scenarios such as high-power semiconductors, high-power lasers, radar RF modules and AI high-computing chips. It can be directly used as chip-mountable heat sinks, thermal spreading substrates and packaging heat dissipation submounts.