Stealth Laser Dicing and Lifting System

This is a Stealth Laser Dicing & Lifting System, a new generation of ultra-precision, damage-free dicing and interlayer peeling equipment specially designed for semiconductor wafers, wide-bandgap materials, quantum crystals, and optical wafers.
Unlike conventional blade dicing and surface laser ablation processes, this system employs a wavelength-transparent pulsed laser that penetrates the material surface and focuses at a specified depth inside the substrate. Through multiphoton nonlinear absorption, it precisely forms an internal modified layer without damaging the top functional structures or surface coatings. Combined with automatic film expansion, mechanical cracking, and interlayer dissociation processes, it achieves ultra-precision processing characterized by zero surface damage, internal pre-scribing, and clean peeling.
The system integrates multiple functions including stealth dicing, micro-crack induction, thin-film peeling, thin wafer cracking, and heterostructure delamination. It completely resolves typical issues in traditional processes such as chipping, debris, thermal damage, residual stress, and interlayer cracking. As a result, it serves as core processing equipment for ultra-thin wafers, quantum diamond chips, third-generation semiconductors, optical components, and high-precision packaging.